Well Organized Facility and Production Environment

Component Preparation General Production Devices Model C.F.15 Lead Former (axial) HEPCO 1500 Lead Former (radial) HEPCO 7900 Lead Former (I.C.) Automated Production Systems RTV Radial Bowl Feed Cutter Automated Production Systems AR-1 Radial Tape Cutter Electrovert Electro Prep SMT Juki Model KE-760L-CE Pick and Place (Factory rated @ 12,000 CPH) Juki Model KE-750L Pick and Place (Factory rated @ 14,400 CPH) Juki Model FS-730Xtra Pick and Place (Factory rated 12,800 CPH) Juki Model ASM-802 Pick and Place (Factory rated @ 4,200 CPH) BTU VIP70A Solder Re-flow System Speedline SPM Screen Printer Speedline Ultra Print 2000 Electrovert Omniflo-7 Seven Zone Reflow Oven Through-Hole IAC Component Mounting Line (Twelve Stations) Electrovert Component Mounting Line (Six Stations) Electrovert Econopak Plus Wave Solder System (Spray Fluxer & Convection Preheat) Second Operations / Touch-up Metcal Soldering Stations Bausch & Lomb Stereo Zoom 4 Microscope Repair and Rework Metcal Dual Function Solder/De-solder Station (1) Metcal Soldering Stations OK Industries FCR-1000 Hot Air Rework Stations (3) Finetech BGA Rework Station (1) Quality Control Sonora IC-9000 Video System CR Tech RTI6500 Automated Optical Inspection System Mantis Vision Stations (2) Software Tools Unicam CIM software, with Gerber and all CAD interfaces Test Checksum MDA-8 Manufacturing Defect Test System Miscellaneous Cambridge Automatic AE2001 Pneumatic Eyeletter (Eyelets and Tubular Rivets) OK Industries solder fountain CAB Depanelizer Streckfuss E044 Selective Soldering/Desoldering System Blue M Curing Machine Placement Specifications Chip comps. down to 0201 Max chip size 33.5mm sq (1.319") BGA - Micro BGA Board size max (SMT) 410mm x 360mm (16.14" x 14.17") Board size min (SMT) 50mm x 30mm (1.96" x 1.18") Board size max (Wave Solder) 16" x 24" Min lead pitch .4mm (.015") BGA pitch .1mm min - 3mm max (.039"-.118")